Session
SONiC Hardening for Mass-Market. Closing the Gaps.
We’ll walk through the engineering trenches:
• The L2+/L3 and other gaps that had to be closed - STP/RSTP/MSTP, Multicast, e.t.c.
• Challenges in platform support
• Productizing SONIC - what is missing
• Missing parts - what people expect and what they get.
We will show Live demo: real switch, real traffic.
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