Thomas Werner
Chipmetrics GmbH
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Thomas graduated from TU Chemnitz. He joined AMD as Integration Engineer in 1996 and worked in AMD’s Development Center (Sunnyvale), AMD’s Fab25 (Austin) and AMD’s Fab30 in Dresden. After the spinoff of Globalfoundries, he worked as Manager for Technology and Integration in the BEOL. In 2015 he joined Fraunhofer IZM as R&D coordinator in advanced packaging. In 2023 Thomas accepted a position as Head of Metrology Wafer Business at Chipmetrics.
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